Bondloc b7063 is used for the cleaning of components prior to bonding depositing a correct balance of neutralising ions on the surface stimulating attraction for the adhesive and preparing the surface for bonding it is primarily designed for the preparation of the interface layer spectak compatible it cleans and mildly primes preventing poor wetting by the adhesive absorption of the lower viscosity super glues into porous items it also helps with anaerobic formulations being compatible with its